: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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Single Or Multi Cavity MGP Molding Tool Mirror Polished QFN Series

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Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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Single Or Multi Cavity MGP Molding Tool Mirror Polished QFN Series

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Single Or Multi Cavity MGP Molding Tool Mirror Polished QFN Series

QFN Series MGP Mold Product Technical Parameters 1. Plastic dual -oil cylinder with a built -in gear shift drive multi -injection molding design; 2. Cavity Bar uses high-speed powder steel, hardness ...

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MGP Molding Mirror Polished

Multi Cavity MGP Molding

Molding Tool Mirror Polished

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