: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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DIP4/8/14/16/18/23/24/25/29/40 MGP Mold DME Base Nickel Plating

Product Categories

Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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DIP4/8/14/16/18/23/24/25/29/40 MGP Mold DME Base Nickel Plating

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DIP4/8/14/16/18/23/24/25/29/40 MGP Mold DME Base Nickel Plating

DIP4/8/14/16/18/23/24/25/29/40 MGP Mold Features: Product Name: IC Lead Frame Stamping Mold Mold Material: NAK80, S136, SKD61, Etc. Surface Treatment: Nickel Plating Runner System: Hot Runner/Cold ...

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DME Base MGP Mold

DME Base semiconductor mold

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